The Definitive Guide to VLSI Physical Design, System-on-Chip (SoC) Integration, and Implementation

The Definitive Guide to VLSI Physical Design, System-on-Chip (SoC) Integration, and Implementation

This book brings together:

• 23 Comprehensive Chapters

• 800+ Pages of Advanced VLSI Knowledge

• Physical Design Foundations & Theory

• Placement, Clock Tree Synthesis & Routing

• Timing Closure, SI/PI & Multi-Corner Optimization

• Low-Power, DFT & Manufacturability Techniques

• Reliability, Thermal Modeling & Power Integrity

• 3D-IC, Chiplets, Advanced Packaging & Heterogeneous Integration

• EDA Automation, Scripting & Machine Learning in PD

As SoC complexity skyrockets and the industry accelerates toward 3D ICs, chiplet-based architectures, and AI-driven automation, physical design engineers are facing some of the biggest challenges in modern chip development.

That’s exactly why I wrote this book to provide a practical, end-to-end guide through the digital backend flow, from RTL-to-GDS, optimized for advanced nodes and future design paradigms.

Inside, you’ll explore:

1. Detailed explanations of placement, CTS, routing, optimization, and signoff

2. Advanced timing, noise, IR-drop, EM, and thermal modeling techniques

3. Step-by-step low-power design, UPF, DFT, and manufacturability workflows

4. Practical insights into chiplet integration, 3D stacking, and packaging methodologies

5. Machine learning applications and EDA automation frameworks for next-gen PD

6. Real-world methodologies to achieve PPA targets at bleeding-edge process nodes

Whether you're:

✅ A physical design engineer working on advanced-node SoCs

✅ A researcher exploring 3D ICs, chiplets, or ML-driven EDA

✅ A student or professional learning the digital backend flow

✅ Or simply passionate about VLSI design and chip implementation

This book is crafted to be your go-to reference for physical design excellence in the era of multi-die systems and AI-driven chip engineering.

Let’s build the future one SoC at a time.